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Micro to meso interconnectionThierry Ondarçuhu, Christian Joachimin collaboration with : Liviu Nicu, Christian Bergaud (LAAS-CNRS, Toulouse) |
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To reduce the number of interconnections levels, to increase the number of nanojunctions tested per wafer, to suppress the photolithography and the wire bonding steps, we have designed, realized and tested a new tool consisting of an array of metallic micro-cantilever. It is a generalization of the use of a single metallic tip cantilever for local electrical testing and of the standard multi-probes head used in microelectronics. This tool makes the connection between micro and macro scales whereas the circuit on the sample makes the micro to nano connection. |
Planar electrical connections with a nanoscale device like a nanowire require 4 levels of interconnections: (i) a planar nanojunction where the molecular device is adsorbed both ends on the junction electrodes (ii) mesoscopic metallic leads which are generally a direct continuation of the nanojunction electrodes, (iii) large metallic pads interconnected to these leads to facilitate the bonding of a metallic wires with a few ten micron-diameter and (iv) those metallic wires bonded using thermo-soldering or conducting past on the pads. |
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 This set-up is very well adapted for the characterization of future
generation of discrete or integrated molecular devices. The nanometric
reproducibility of the displacement of the tool with respect to
the surface was also used for AFM tip deposition of clusters at
a predefined place of a surface (such as a nanojunction) by Dip
Pen Lithography . T. Ondarçuhu, L. Nicu, S. Cholet, C. Bergaud,
S. Gerdes, C. Joachim, Rev. Sci. Instr.
71 (2000) 2087-2093.
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